The Fraunhofer-Gesellschaft (www.fraunhofer.com) currently operates 76 institutes and research institutions throughout Germany and is the world’s leading applied research organization. Around 30 800 employees work with an annual research budget of 3.0 billion euros.
Fraunhofer ENAS is one of the world's leading institutes in the field of heterogeneous integration (MEMS, CMOS) at the wafer and chip level. The wafer-level MEMS package must allow access to the desired media to be measured (e.g., liquids, gases or light), but at the same time shield unwanted external influences. These connection technologies are not only applied to passive elements but are also used for active elements such as micromirrors and print heads. Electronic components must also be included in the microsystem to further advance system integration. In addition to hybrid integration at chip-level, the System Packaging department is carrying out investigations into integration at the wafer level. In such a vertical stack, particular attention must be paid to the influences of the individual connection technologies (temperature, pressure) as well as the electrical and thermal behavior of the system. A complete clean room preparation line including metallization, characterization equipment for processing 4" to 8" substrates is available for permanent and temporary bonding at the wafer level.
We are therefore looking for dedicated Master's students to join our multidisciplinary team and contribute to cutting-edge research in the field of wafer bonding and system packaging.
What you will do
- Together we will define a topic for your research work.
- You will do literature research and thus build up a basic understanding of processes in microsystems technology.
- The topic can involve metallization (involving electrochemical deposition), innovative materials, wafer bonding such as direct,
anodic and hybrid bonding. You will develop an in-depth understanding of the topic. - You will work independently on your tasks, including planning and conducting experiments. Finally, you will summarize your research results in the form of a final thesis.
What you bring to the table
- You are currently studying for a Master's degree in electrical engineering, mechanical engineering,
materials science or a similar field of study. - You have a good knowledge of microsystems technology and, ideally, have already worked with
wafer bonding or packaging technologies. - You are familiar with the common MS Office applications.
- Knowledge of Python programming and its application in scientific research would be an advantage.
- You are characterized by an independent way of working.
- You are communicative and a team player.
- It would also be an advantage if you already have project experience in the field of computer vision and pattern recognition,
but this is not a mandatory requirement.
What you can expect
- You will work in a multidisciplinary team.
- Of course, we will provide you with extensive training and you will have permanent contact persons at your disposal.
- You will have the opportunity to work on exciting and innovative projects.
- We offer you a highly interesting working environment.
- Flexible working hours allow you to combine your studies with your thesis.
We value and promote the diversity of our employees' skills and therefore welcome all applications - regardless of age, gender, nationality, ethnic and social origin, religion, ideology, disability, sexual orientation and identity. Severely disabled persons are given preference in the event of equal suitability.
With its focus on developing key technologies that are vital for the future and enabling the commercial utilization of this work by business and industry, Fraunhofer plays a central role in the innovation process. As a pioneer and catalyst for groundbreaking developments and scientific excellence, Fraunhofer helps shape society now and in the future.
Interested? Apply online now. We look forward to getting to know you!
Fraunhofer Institute for Electronic Nano Systems ENAS
Requisition Number: 71536 Application Deadline: from now
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